CAPABILITIES

Nanoshift provides foundry services for R&D lots to low volume production. Our standard fabrication capabilities can be ordered piece-wise as modular steps or can be engaged as full scale development to production programs offering exceptional value and delivery time. In addition to our standard offerings, we remain flexible to discuss custom processes not supported elsewhere.

A major benefit of our foundry services is the ease at which both small and large batches of a variety of substrate sizes can be processed unlike at traditional semiconductor foundries. We currently handle substrates ranging from small dies up to 8” (200mm) in a variety of shapes and materials.

Standard Semiconductor and MEMS processing techniques available:

  • - 100mm (4”), 150mm (6”) wafer and 156mm psuedo square standard Processing
  • - Custom size, shape and substrate processing up to 200mm (8“)
  • - Mask generation and layout
  • - Photolithography
    • Contact
    • Proximity
    • Projection
    • Front-backside Align
    • E-beam
    • Shadow
    • Custom resist processing
  • - Diffusion
    • CVD and LPCVD
    • Oxide
    • Nitride
    • SiGe
    • LTO
    • LSN
    • PolySilicon
    • SiC
    • POCL3
    • Solid State Doping
    • Rapid Thermal Annealing
    • Sintering
  • - Film deposition
    • PECVD
    • PVD (Evaporation and Sputtering)
    • TEOS
    • Metals
    • Piezoelectrics (AlN)
    • Dielectrics
    • Various Polymers
    • Plating
  • - Dry etch
    • DRIE (Si and Oxide)
    • XeF2
    • Si
    • Oxide
    • Nitride
    • Polysilicon
    • Metals
    • Diamond
    • Ionmill
    • Miscellaneous Plasma
  • - Wet etch
    • KOH
    • TMAH
    • HF
    • many other wet Metal and Dielectric etch chemistries
  • - Release
    • Vapor HF
    • CPD
    • Ultrasonic
  • - Bonding and packaging
    • Aligned Thermal
    • Compression
    • Anodic
    • Eutectic
    • Polymer and Wire bonding
    • Dicing
    • Wafer capping
  • - Testing / Metrology
    • Probing
    • Profilometry
    • SEM
    • Optical Microscopy
    • Thin film DUV and Ellipsometry
    • Stress
  • - Polymer
    • SU-8
    • Parylene
    • PDMS
    • Fabrication
  • - Custom Processes
    • FIB
    • Circuit Edit
    • CMP
    • Injection Molding
    • Machining