FABRICATION CAPABILITIES
Nanoshift provides foundry services for R&D lots to low volume production. Our standard fabrication capabilities can be ordered piece-wise as modular steps or can be engaged as full scale development to production programs offering exceptional value and delivery time. In addition to our standard offerings, we remain flexible to discuss custom processes not supported elsewhere.
A major benefit of our foundry services is the ease at which both small and large batches of a variety of substrate sizes can be processed unlike at traditional semiconductor foundries. We currently handle substrates ranging from small dies up to 8” (200mm) in a variety of shapes and materials.
Standard Semiconductor and MEMS processing techniques available:
- - 100mm (4”), 150mm (6”), and select 200mm (8”) standard processing
- - Custom size, shape, and substrate material types and processing for chips to non-standard sizes and shapes
- - Mask generation and layout
- - Photolithography
- Contact
- Proximity
- Projection
- Front-backside Align
- E-beam
- Shadow
- Custom Resist Processing (I-line, G-line, DUV, Thick Resists, Custom)
- - Diffusion
- CVD and LPCVD
- Oxide, Oxynitride, HTO
- Nitride, LSN
- SiGe, Ge
- LTO
- PolySilicon
- SiC
- POCL3, BCl3 doping
- Solid State Doping
- Rapid Thermal Annealing
- Sintering
- - Film deposition
- ALD
- PECVD
- PVD (Evaporation and Sputtering)
- TEOS
- Metals
- Piezoelectrics (AlN)
- Dielectrics
- Various Polymers
- Plating
- - Dry etch
- DRIE (Si and Oxide)
- XeF2
- Si
- Oxide
- Nitride
- Polysilicon
- Metals
- Diamond
- Ionmill
- Miscellaneous Plasma Etch
- - Wet etch
- All Major Dielectric Wet Etches
- All Major Metal Wet Etches
- All Major Silicon and Glass Wet Etches
- Custom Wet Etch Chemistries by Request
- HF
- KOH
- TMAH
- - Release
- Vapor HF
- CPD
- Ultrasonic
- - Bonding and packaging
- Aligned Thermal
- Compression
- Anodic
- Eutectic
- Polymer and Wire bonding
- Dicing
- Wafer capping
- - Testing / Metrology
- AFM
- EDX/EDX
- FIB
- Probing
- Profilometry
- SEM
- Optical Microscopy
- Thin film DUV and Ellipsometry
- Stress
- XRD
- - Polymer
- BCB
- KMPR
- Parylene
- PBO
- PDMS
- Polyimide
- PPS
- Pyrolysis
- SU-8
- - Custom Processes
- Circuit Edit
- CMP (Dielectric, Metal, Silicon)
- Etch Back
- Graphene
- Implantation
- Injection Molding
- Laser Processing
- Machining
- Mechanical Drilling (Si and Glass)
- Polish (KISS)
- Stress Balance Compensation
- Wafer grind