SPECIALTY PROCESS EXPERTISE

Nanoshift continues to challenge itself by staying current and contributing to the latest technology trends.

Below is a list of our notable specialty process expertise:

  • - Deep Reactive Ion Etching (DRIE)
  • - Thru Silicon Vias (TSV)
  • - 3D-IC
  • - Piezoelectrics
  • - Wafer Level Packaging (WLP)
  • - Glass Processing
  • - Release
  • - Polymer Processing
  • - Non-standard Material Processing
  • - Flex Devices
  • - Conformal Coatings
  • - Shadow Masking